Aluminum was electrodeposited with constant current on AZ31 magnesium alloy pretreated under optimized conditions from trimethyl-phenyl-ammonium chloride and anhydrous aluminum chloride (TMPAC-AlCl3) quaternary ammonium room temperature ionic liquids with benzene as a co-solvent. The corrosion resistance of the as-deposited Al layers was evaluated in 3.5% NaCl solution by the electrochemical technologies. The Al depositions were characterized by scanning electron microscopy equipped with energy dispersion X-ray. The results show that the microstructures of the Al depositions have spherical equiaxed grains obtained at a high current density, and bulk grains at a low current density. The Al deposition obtained at 12.3 mA/cm2 has a smooth and compact surface. The electrochemical measurements indicate that the thicker Al deposition can more effectively protect the Mg substrate. The Al deposition with bulk grains hardly protects the AZ31 Mg substrate from corrosion owing to its porosity.
It is difficult to directly electroplate Al on Mg alloys. The effects of pretreatment parameters on the corrosion resistance of films obtained on AZ31 Mg alloy surface were studied by using potentiodynamic polarization curves, to produce a compact interfacial layer as zinc-immersion deposition. After the substrate was pretreated under optimized conditions, aluminum was electrodeposited on AZ31 from TMPAC-AlCl3 room temperature ionic liquids. The depositions were characterized by scanning electron microscope equipped with energy dispersion X-ray. The results show that the traditional pretreatment of Mg alloys was successfully used for the Al-electroplating process from TMPAC-AlCl3 ionic liquids. The entire procedure includes alkaline cleaning, chemical pickling, surface activation (400 mL/L HF acid, 10 min), zinc-immersion (20 min) and anhydrous treatment. A relatively compact zinc-immersion film was prepared on the substrate surface. A silvery-colored satin aluminum deposition was obtained on AZ31 from TMPAC-AlCl3 using direct current plating.