We propose a hierarchical interconnection network with two-phase bufferless resonant clock distribution, which mixes the advantages of mesh and tree architectures.The problems of skew reduction and variation-tolerance in the mixed interconnection network are studied through a pipelined multiplier under a TSMC 65 nm standard CMOS process.The post-simulation results show that the hierarchical architecture reduces more than 75% and 65%of clock skew compared with pure mesh and pure H-tree networks,respectively.The maximum skew in the proposed clock distribution is less than 7 ps under imbalanced loading and PVT variations,which is no more than 1%of the clock cycle of about 760 ps.
A novel layout has been proposed to reduce the single event upset(SEU) vulnerability of SRAM cells.Extensive 3-D technology computer-aided design(TCAD) simulation analyses show that the proposed layout can recover the upset-state much easier than conventional layout for larger space of PMOS transistors.For the angle incidence,the proposed layout is immune from ion hit in two plans,and is more robust against SEU in other two plans than the conventional one.The ability of anti-SEU is enhanced by at least 33% while the area cost reduced by 47%.Consequently,the layout strategy proposed can gain both reliability and area cost benefit simultaneously.
