Effect of direct current electric field （DCEF） on corrosion behaviour of copper printed circuit board （PCB-Cu）, Cl-ion migration behaviour, dendrites growth under thin electrolyte layer was investigated using potentiodynamic polarization and scanning electron microscopy （SEM） with energy dispersive spectrometer （EDS）. Results indicate that DCEF decreases the corrosion of PCB-Cu;Cl-ions directionally migrate from the negative pole to the positive pole, and enrich on the surface of the positive pole, which causes serious localized corrosion; dendrites grow on the surface of the negative pole, and the rate and scale of dendrite growth become faster and greater with the increase of external voltage and exposure time, respectively.
A loop system was used to investigate the effect of flow velocity on corrosion behavior of AZ91 D magnesium alloy at an elbow of loop system based on array electrode technology by polarization, computational fluid dynamics(CFD) simulation and surface analysis. The experimental results showed that the corrosion rate increased with increasing flow velocity, and a critical flow velocity could exist in the corrosion of AZ91 D magnesium alloy. When flow velocity exceeded the critical flow velocity, fluid hydrodynamics was dominant in the corrosion of AZ91 D magnesium alloy. On the contrary, the electrochemical factors were dominant.
