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国家自然科学基金(51102020)

作品数:5 被引量:5H指数:1
相关作者:杨萌萌张心强赵鸿滨杜军屠海令更多>>
相关机构:北京有色金属研究总院更多>>
发文基金:国家自然科学基金国家科技重大专项更多>>
相关领域:理学电子电信金属学及工艺更多>>

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Resistive switching characteristics of Dy_2O_3 film with a Pt nanocrystal embedding layer formed by pulsed laser deposition被引量:3
2014年
Resistive switching (RS) behaviors of Dy2O3- based memory devices with and without Pt nanocrystals (Pt-nc) layer were investigated for nonvolatile memory applications. The Cu/Pt-nc/Dy2O3/Pt memory exhibits excellent unipolar RS characteristics, including highly uniform switching parameters, lower switching voltage (〈1.2 V), high resistance ratio (〉1 × 104), a large number of switching cycles, as well as long retention time (〉1 × 105 s), owing to the local electric field confined and strengthened near the nanocrystals' location.
Hong-Bin ZhaoHai-Ling TuFeng WeiXin-Qiang ZhangYu-Hua XiongJun Du
Energy band alignment of HfO2 on p-type(100)InP
2017年
The band alignment of HfO2 film on p-type (100) InP substrate grown by magnetron sputtering was investigated.The chemical states and bonding characteristics of the system were characterized by X-ray photoelectron spectroscopy (XPS).The results show that there is no existence of Hf-P or Hf-In and there are interfacial In2O3 and InPO4 at the interface.Ultraviolet spectrophotometer (UVS) was employed to obtain the band gap value of HfO2.In 3d and Hf 4f core-level spectra and valence spectra were employed to obtain the valence band offset of HfO2/InP.Experimental results show that the (5.88 ± 0.05) eV band gap of HfO2 is aligned to the band gap of InP with a conduction band offset (△Ec) of (2.74 ± 0.05) eV and a valence band offset (△Ev) of (1.80 ± 0.05) eV.Compared with HfO2 on Si,HfO2 on InP exhibits a much larger conduction band offset (1.35 eV larger),which is beneficial to suppress the tunneling leakage current.
Meng-Meng YangHai-Ling TuJun DuFeng WeiYu-Hua XiongHong-Bin ZhaoXin-Qiang Zhang
关键词:HFO2INP
Effects of NH_3 annealing on interface and electrical properties of Gd-doped HfO_2/Si stack被引量:1
2013年
Effects of NH3 rapid thermal annealing (RTA) on the interface and electrical properties of Gd-doped HfO2 (GDH)/Si stack were investigated. The process of NH3 annealing could significantly affect the crystallization, stoichiometric properties of GDH film and the interface characteristic of GDH/Si system. NH3 annealing also led to the decrease of interface layer thickness. The leakage current density of Pt/GDH/p-Si MOS capacitor without RTA was 2× 10-3 A/cm2. After NH3 annealing, the leakage current density was about one order of magnitude lower (3.9× 104 A/cm2). The effective permittivity extracted from the C-V curves was -14.1 and 13.1 for samples without and with RTA, respectively.
杨萌萌屠海令杜军魏峰熊玉华赵鸿斌
关键词:HIGH-KINTERFACE
Gd_2O_3-HfO_2栅介质薄膜的外延制备及Ge-MOS电学特性分析被引量:1
2012年
以Gd2O3-HfO2(GDH)固溶氧化物作为靶材,采用脉冲激光沉积技术(PLD)在Ge(100)衬底上制备了GDH高k栅介质外延薄膜,其外延生长方式为"cube-on-cube",GDH薄膜与Ge(100)衬底的取向关系为(100)GDH∥(100)Ge和[110]GDH∥[110]Ge。通过反射式高能电子衍射(RHEED)技术研究了激光烧蚀能量和薄膜沉积温度对薄膜晶体结构的影响,分析了二者与薄膜的取向关系,激光烧蚀能量对薄膜取向影响更为显著。得到较优的GDH外延薄膜沉积工艺为:激光烧蚀能量为3 J·cm-2、薄膜的沉积温度为600℃。用磁控溅射制备了Au/Ti顶电极和Al背电极,其中圆形的Au/Ti电极通过掩膜方法获得,直径为50μm。采用Keithley 4200半导体测试仪对所制备Au/Ti/GDH/Ge/Al堆栈结构的Ge-MOS原型电容器进行电学特性分析,测试条件为:I-E测试的电场强度0~6 MV·cm-1,C-V测试的频率300 kHz~1 MHz,结果表明,厚度为5 nm的GDH薄膜具备良好介电性能:k~28,EOT~0.49 nm,适于22 nm及以下技术节点集成电路的应用。
张心强屠海令杜军杨萌萌赵鸿滨杨志民
关键词:GD2O3HFO2
Al_2O_3界面钝化与热处理对Gd_2O_3-HfO_2高k薄膜电性能影响
2012年
采用磁控溅射技术在p-Si(100)衬底上生长了Gd2O3掺杂HfO2(GDH)高k薄膜,制备了GDH/Si和GDH/Al2O3/Si两种堆栈层。结果表明Al2O3界面钝化使漏电流密度降低了两个数量级,并改善了回滞窗口和平带电压的偏移。高温N2退火对堆栈层电学性能影响明显:随着温度的增加,界面性能逐步改善,退火温度为900℃时,回滞窗口小于20 mV,积累区趋势平缓并且单位面积电容值增大,薄膜介电常数为20。
郭亿文张心强熊玉华杜军杨萌萌赵鸿滨
关键词:AL2O3快速退火
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