研究了热退火对InGaN/GaN多量子阱LED的Ni/Au p GaN欧姆接触的影响。发现在空气和N2气氛中交替地进行热退火的过程中Ni/Au接触特性显示出可逆现象。Ni/Au p GaN接触的串联电阻在空气中随合金化时间逐渐减小,在随后的N2中的热退火后会使该串联电阻增加,但在空气中再次热退火能使接触特性得到恢复。同时对Ni/Au p GaN接触在空气中合金化过程中的层反转的成因进行了讨论。
High quality GaN films on (0001) sapphire substrates were grown by a commercial MOCVD system (Thomas Swan Corp.).The etch pits and threading dislocations(TDs) in GaN films have been studied by chemical etching methods such as mixed acid solution (H 3PO 4∶H 2SO 4=1∶3) and molten KOH,HCl vapor etching method,scanning electron microscope (SEM) and transmission electron microscope(TEM).SEM images of the same position of GaN films with HCl vapor etching and wet etching methods show notably different densities and shapes of etching pits.The results indicate that HCl vapor etching can show pure edge,pure screw and mixed TDs,mixed acid solution can show pure screw and mixed TDs and molten KOH wet etching only can show pure screw TDs.
Waveguide characteristics of symmetrical separate confinement heterojunction multi quantum well (SCH MQW) AlGaN/GaN/InGaN laser diode (LD) are studied by using one dimensional (1 D) transfer matrix waveguide approach.Aiming at photon confinement factor,threshold current,and power efficiency,layers design for SCH MQW LD is optimized.The optimal layers parameters are 3 periods In 0.02 Ga 0.98 N/In 0.15 Ga 0.85 N QW for active layer,In 0.1 Ga 0 9 N for waveguide layer with 90nm thick,and 120×(2 5nm/2 5nm) Al 0.25 Ga 0 75 N/GaN supper lattices for cladding layer with the laser wavelength of 396 6nm.
